[ Technology Blogs Articles News Reviews ]

www Technoclicks.com
Post Tech Blog Article News Reviews

Top Articles

CMD to build 200-, 300-mm fabs in China

Posted by inet - 2005-11-05

A little-known group called CMD International (Tianjin) Electronic Co. Ltd. has broken ground on a large-scale semiconductor and R&D project in Tianjin, China, with claims that it will build both 200- and 300-mm fabs in that nation. The fab project is still in the very early stages, however.

Over the next five years, CMD claims that it will build a plant to produce 200- and 300-mm CMOS chips, a gallium-arsenide (GaAs) integrated circuit fab, and an R&D center for related products. The total investment will exceed $2.5 billion.

Little is known about CMD, which is said to comprise of “several large companies engaged in integrated circuit production and R&D that are located in the United States' Silicon Valley,” according to the Tianjin Economic-Technological Development Area (TEDA).

There are signs that the fab project is still in the early stages, given the lack of details or investors involved in the effort.

A spokesman for TEDA in a phone interview decline to identify which companies are involved, but indicated that the state-run entity is talking to a couple of undisclosed parties about investing in the fab project. The TEDA will provide an update on the project later this year, the spokesman said.

The chip project is a cooperative effort between TEDA, Senbang Group and CMD. TEDA was established in 1984, upon the approval of the State Council of the People's Republic of China. It was one of the first state-level economic and technological development zones in the country.

Located in the centre of the Circum-Bohai economic circle and in the east of the Eurasia continental bridge, TEDA is a portal to such two metropolises as Beijing and Tianjin. So far over 3,300 overseas-founded companies have settled in TEDA. Among them include Motorola, Samsung, and Toyota.

Related Category :

Network ||

Next ....: MCI's Final Financials Before Merger With Verizon

:: Previous Articles
:: STATS ChipPAC opens wafer bump plant in China
:: Sun's Disaster Recovery Software Gets Global Reach
:: IBM's Meyerson: Time for DFM to 'come of age'

Recent Articles



Home | | Members | Search | Upadtes | RSS | Tags | Site Map | Tags | Conact

© Technoclicks.com - All rights reserved.