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STATS ChipPAC opens wafer bump plant in China

Posted by iNext - 2005-11-05

MANHASSET, N.Y. — Singapore-based semiconductor test and packaging services supplier STATS ChipPAC has announced it will open a 200-mm wafer bumping operation in China specializing in gold bump services for the liquid crystal display (LCD) driver market.

The new operation will also provide wafer sort services for LCD driver integrated circuits (ICs) as well as mixed signal devices.

The wafer bumping and sort operation will be located in Songjiang Science and Technology Park in the Songjiang District of Shanghai. STATS ChipPAC plans to install gold bump and wafer sort equipment in the new operation by the end of 2005 and expects to reach volume production by mid-2006.

Tan Lay Koon, president and chief executive of STATS, said in a statement, "Our new 200mm wafer bumping and sort operation underscores STATS ChipPAC's continued strong commitment to expanding back-end supply chain solutions in China. Strategically, we are confident that LCD customers will benefit from having gold bump and wafer sort services located in Songjiang. In addition, STATS ChipPAC's new China facility will expand our wafer sort capacity for mixed signal devices."



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