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IBM to use immersion litho at 45-nm

Posted by inet - 2006-04-29

IBM Corp.’s Microelectronics Group plans to deploy 193-nm immersion lithography in production at the 45-nm node, according to a company official.

And in an apparent move to hedge its bets, IBM will also use its current 193-nm “dry” lithography tools at the 45-nm node as well.

“We will use a mix,” said Tom Gow, director of 300-mm manufacturing engineering at IBM, in an interview.

For some time, IBM, ASML and Albany Nanotech have been working together on the development of immersion lithography. Last year IBM’s Microelectronics Group said it would insert the technology within its 300-mm production fab in East Fishkill, N.Y.

“We’ve been working with immersion for a long time,” Gow said.

Citing strong results in its semiconductor and other businesses, IBM recently said that first-quarter income from continuing operations was $1.7 billion, up 21 percent from $1.4 billion a year ago.



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