LONDON — STMicroelectronics is offering a a family of six multichip package (MCP) memories intended for use in multimedia-capable 3G and CDMA mobile phones and in other portable devices.
The series offers memory densities of 256-Mbit to 1-Gbit of NAND flash together with 256-Mbit or 512-Mbit of DRAM in a single package. ST does not make DRAM but works closely with Hynix Semiconductor Inc., a DRAM maker, on the production of flash memory.
ST did not disclose where it was obtaining the DRAMs from or whether it was making or buying the flash memories. The NAND flash and DRAM components have separate power supplies and ground lines, as well as separate control, address and I/O signals, to allow simultaneous access to both chips, ST said.